BE Semiconductor Industries Company Description
Where would BE Semiconductor Industries (BESI) be without semiconductor packaging and plating equipment? Semiconductor manufacturers use BESI's packaging and plating gear in the finishing steps of chip production. The company's Fico subsidiary makes package molding and trim and form systems that put the final touches on a chip. BESI also sells plating, singulation, and flip chip die attach systems. The company has reworked its portfolio of subsidiaries to exit the market for chip leadframes and to enter the market for die-sorting equipment. BESI's global client roster includes big chip makers, such as Agere, Infineon (+10% of sales), Philips, and STMicroelectronics.
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The Company Description provides a historical perspective of BE Semiconductor Industries's organization from inception to current status.
Produced by Hoover's in-house editorial team, the Company Description tracks ownership transitions, company progress via mergers and acquisitions, major growth milestones, and strategic initiatives, to provide a holistic view of BE Semiconductor Industries's evolution in the marketplace.
